Disruptive Innovation and Organic Electronics

FlexTech 2010

Given PARC's unique capabilities in the flexible, printed, and organic electronic applications, I am glad to report that the FlexTech 2010 show was well attended.

PARC presented two workshops on current work and Mark Bernstein, PARC's CEO, gave a keynote speech on disruptive technology.

PARC and Disruptive Technology in an Emerging Eco-system

Mark's keynote on "The changing model: Moving technologies from research to applications" focuses on what happens when new emerging technology is disrupting industry dynamics. In this scenario, the ability to find and collaborate with the right partners becomes imperative.

View more presentations from PARC (Palo Alto Research Center).

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2010 Flexible Electronics & Displays Conference

PARC at 2010 FlexTech

PARC will be actively participating in the upcoming 2010 FlexTech.

* Feb 2 Keynote session: "Moving technologies from the lab to real-world applications" by Mark Bernstein, CEO of PARC.

* Feb 3 "Flexible Printed Sensor Tape based on Solution Processed Materials" and "Sensing of blast events with flexible sensor tapes" - discussion of current projects by PARC technologists.

* Feb 2-4 PARC will be at booth 204 showcasing services in material characterization and optimization, application development, and system prototyping. Come by to see samples and learn about what PARC can do for your product road-map.

Flexible and Printed Electronics at PARC

PARC has been engaging in works related to both flexible and printed electronics for long time. And, PARC is a global organization that can provide both the technical (hard and soft) infrastructure and commercialization capabilities for our partners in this emerging technology area.

For more information on PARC's work in flexible and printed electronics.

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Flexible Electronics: Materials and Applications

The Textbook

Flexible Electronics: Materials and Applications

Given PARC's work in flexible and printed electronics. It is little surprise that we also write the textbook on this topic. And, this is my reference reading material before attending Printed Electronics USA 2009.

Printed Electronics at PARC

Here are some of the areas that we are working on right now:
- PEN substrate
- Ink-jet printing (nanoparticle)
- Polymer dielectrics
- Polymer semiconductor

In our facility, we support different print head technologies and can customize to each project's specific needs. So far, we have done work with Microfab, Spectra, and Xerox print heads.

Sensors and applications

An area that we are seeing a lot of interests in is printed flexible sensors. We have a project that measures acceleration, pressure, acoustic, and thermal status then incorporates memory and CMOS (logic) into a single printed sensor tape. The initial work is for DARPA but it would have wide civilian applications once the technical kinks have been worked out.

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Printed Electronics USA 2009 Report

PARC's Printed Electronics



PARC participated in PEUSA09 as technical presenter, facility tour sponsor, and exhibitor. Come to this annoucnement if you like to download the assets that you have seen in the show.

PEUSA09 Field Report

Several people commented that printed electronics seem to have developed a robust vendor/supplier base. And, as people stake out their claim in the upstream value-chain, the next step would be for early adopter consumers/buyers to set the application directions.

Beyond the traditional application of OLED (organic light-emitting diode - bendable display screen), flexible and disposable sensors seem to be another area that can be high value-add yet difficult to achieve with traditional silicon based solutions.

Looking at the value-chain, "system integrators" services probably will play an important match making role for the immediate future as the buyers often do not have the development capabilities in-house for printed electronics while the suppliers may be too limited, albeit very in-depth, on the modules and materials.

Not surprisingly, these are the services (characterization & optimization, application development, and full-system prototyping) that PARC offers. More importantly, we have had a lot of interesting conversations with both vendors and buyers to work with PARC.

If you are interested in what PARC can do for you in printed electronics, pls contact PEUSA09@parc.com

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PARC at Printed Electronics USA 2009

Printed Electronics USA

A leader in Printed Electronics, PARC offers three unique capabilities to industry partners:

* Material Characterization: Characterizing and optimizing material performance in devices and circuits for printed electronics market materials suppliers;
* Application Development: Designing circuits and fabricating proof of concept, including sensors and display elements for clients exploring specific applications; and
* Full System Prototyping: Integrating complete systems containing printed electronics and conventional thin film components and/or standard silicon circuitry.

Please visit PARC at Booth 12 or contact PEUSA09@parc.com for more information. For more information on PARC's Printed Electronics capabilities, please visit www.parc.com/peusa09.

Jet-Printing: From Drops to Electronic Devices

Dr. Jurgen Daniel will be presenting in the conference on December 3rd at 12:05pm, discussing how to use jet-printing to fabricate flexible backplanes for driving displays and sensor-tapes for recording blast events in the battlefield.

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