Tuesday, December 8, 2009

Flexible Electronics: Materials and Applications

The Textbook

Flexible Electronics: Materials and ApplicationsFlexible Electronics: Materials and Applications

Given PARC's work in flexible and printed electronics. It is little surprise that we also write the textbook on this topic. And, this is my reference reading material before attending Printed Electronics USA 2009.

Printed Electronics at PARC

Here are some of the areas that we are working on right now:
- PEN substrate
- Ink-jet printing (nanoparticle)
- Polymer dielectrics
- Polymer semiconductor

In our facility, we support different print head technologies and can customize to each project's specific needs. So far, we have done work with Microfab, Spectra, and Xerox print heads.

Sensors and applications

An area that we are seeing a lot of interests in is printed flexible sensors. We have a project that measures acceleration, pressure, acoustic, and thermal status then incorporates memory and CMOS (logic) into a single printed sensor tape. The initial work is for DARPA but it would have wide civilian applications once the technical kinks have been worked out.


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